Sanjoy Saha
Sanjoy Saha
Thermal Core Competency Manager at Intel Corporation
Verified email at
Cited by
Cited by
Brownian dynamics simulation to determine the effective thermal conductivity of nanofluids
P Bhattacharya, SK Saha, A Yadav, PE Phelan, RS Prasher
Journal of Applied Physics 95 (11), 6492-6494, 2004
Phonon backscattering and thermal conductivity suppression in sawtooth nanowires
AL Moore, SK Saha, RS Prasher, L Shi
Applied Physics Letters 93 (8), 2008
Thermal contact resistance and thermal conductivity of a carbon nanofiber
C Yu, S Saha, J Zhou, L Shi, AM Cassell, BA Cruden, Q Ngo, J Li
Integration of metal oxide nanobelts with microsystems for nerve agent detection
C Yu, Q Hao, S Saha, L Shi, X Kong, ZL Wang
Applied Physics Letters 86 (6), 2005
Measurement and analysis of thermopower and electrical conductivity of an indium antimonide nanowire from a vapor-liquid-solid method
JH Seol, AL Moore, SK Saha, F Zhou, L Shi, QL Ye, R Scheffler, N Mingo, ...
Journal of applied physics 101 (2), 2007
Molecular dynamics simulation of thermal transport at a nanometer scale constriction in silicon
SK Saha, L Shi
Journal of applied physics 101 (7), 2007
Phase sensitive enhancement for biochemical detection using rotating paramagnetic particle chains
AK Vuppu, AA Garcia, MA Hayes, K Booksh, PE Phelan, R Calhoun, ...
Journal of applied physics 96 (11), 6831-6838, 2004
Monte Carlo simulation of phonon backscattering in a nanowire
S Saha, L Shi, RS Prasher
ASME International Mechanical Engineering Congress and Exposition 47845, 549-553, 2006
Combined thermoelectric and structure characterizations of patterned nanowires
A Mavrokefalos, MT Pettes, S Saha, F Zhou, L Shi
2006 25th International Conference on Thermoelectrics, 234-237, 2006
Modeling microflow and stirring around a microrotor in creeping flow using a quasi-steady-state analysis
AK Vuppu, AA Garcia, SK Saha, PE Phelan, MA Hayes, R Calhoun
Lab on a Chip 4 (3), 201-208, 2004
Thermal management of packages with 3D die stacking
CP Chiu, JY Chang, S Saha
2012 7th International Microsystems, Packaging, Assembly and Circuits …, 2012
Three-dimensional (3d) integrated heat spreader for multichip packages
HK Dhavaleswarapu, RD Flynn, SK Saha
US Patent App. 14/108,270, 2015
High performance transient uniform cooling solution for thermal compression bonding process
Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ...
US Patent 9,434,029, 2016
A unique computer-based spectrophotometric system with multiple height exposures of the cuvette to determine vertical velocity of spermatozoa for clinical and biological …
D Paul, GC Majumder, S Saha, A Mukherjee, S Banerjee
Indian Patent Application File, 2004
Determining the effective thermal conductivity of a nanofluid using Brownian dynamics simulation
P Bhattacharya, SK Saha, A Yadav, PE Phelan, RS Prasher
Heat Transfer Summer Conference 36959, 777-783, 2003
Molecular dynamics simulation of thermal transport at nanometer size point contacts on a planar silicon substrate
S Saha, L Shi
Heat Transfer Summer Conference 47314, 389-396, 2005
Simulated behavior of magnetic and nonmagnetic particles in a rotating magnetic field
SK Saha
Arizona State University, 2003
Challenges and opportunities in thermal management of multi-chip packages
HK Dhavaleswarapu, CM Jha, SF Smith, S Kothari, B Bicen, SK Saha, ...
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
Reliability of base-isolated liquid storage tanks under horizontal base excitation
SK Saha, VA Matsagar
Numerical methods for reliability and safety assessment: Multiscale and …, 2015
Wind Response of Base-Isolated Building
SK Saha, VA Matsagar, A Gupta
14th International Conference on Wind Engineering, Porto Alegre, Brazil, 2015
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