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Sanjoy Saha
Sanjoy Saha
Thermal Core Competency Manager at Intel Corporation
Verified email at intel.com
Title
Cited by
Cited by
Year
Brownian dynamics simulation to determine the effective thermal conductivity of nanofluids
P Bhattacharya, SK Saha, A Yadav, PE Phelan, RS Prasher
Journal of Applied Physics 95 (11), 6492-6494, 2004
4512004
Phonon backscattering and thermal conductivity suppression in sawtooth nanowires
AL Moore, SK Saha, RS Prasher, L Shi
Applied Physics Letters 93 (8), 2008
2422008
Thermal contact resistance and thermal conductivity of a carbon nanofiber
C Yu, S Saha, J Zhou, L Shi, AM Cassell, BA Cruden, Q Ngo, J Li
2212006
Integration of metal oxide nanobelts with microsystems for nerve agent detection
C Yu, Q Hao, S Saha, L Shi, X Kong, ZL Wang
Applied Physics Letters 86 (6), 2005
2062005
Measurement and analysis of thermopower and electrical conductivity of an indium antimonide nanowire from a vapor-liquid-solid method
JH Seol, AL Moore, SK Saha, F Zhou, L Shi, QL Ye, R Scheffler, N Mingo, ...
Journal of applied physics 101 (2), 2007
1282007
Molecular dynamics simulation of thermal transport at a nanometer scale constriction in silicon
SK Saha, L Shi
Journal of applied physics 101 (7), 2007
592007
Phase sensitive enhancement for biochemical detection using rotating paramagnetic particle chains
AK Vuppu, AA Garcia, MA Hayes, K Booksh, PE Phelan, R Calhoun, ...
Journal of applied physics 96 (11), 6831-6838, 2004
282004
Monte Carlo simulation of phonon backscattering in a nanowire
S Saha, L Shi, RS Prasher
ASME International Mechanical Engineering Congress and Exposition 47845, 549-553, 2006
172006
Combined thermoelectric and structure characterizations of patterned nanowires
A Mavrokefalos, MT Pettes, S Saha, F Zhou, L Shi
2006 25th International Conference on Thermoelectrics, 234-237, 2006
132006
Modeling microflow and stirring around a microrotor in creeping flow using a quasi-steady-state analysis
AK Vuppu, AA Garcia, SK Saha, PE Phelan, MA Hayes, R Calhoun
Lab on a Chip 4 (3), 201-208, 2004
132004
Thermal management of packages with 3D die stacking
CP Chiu, JY Chang, S Saha
2012 7th International Microsystems, Packaging, Assembly and Circuits …, 2012
102012
Three-dimensional (3d) integrated heat spreader for multichip packages
HK Dhavaleswarapu, RD Flynn, SK Saha
US Patent App. 14/108,270, 2015
92015
High performance transient uniform cooling solution for thermal compression bonding process
Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ...
US Patent 9,434,029, 2016
72016
A unique computer-based spectrophotometric system with multiple height exposures of the cuvette to determine vertical velocity of spermatozoa for clinical and biological …
D Paul, GC Majumder, S Saha, A Mukherjee, S Banerjee
Indian Patent Application File, 2004
52004
Determining the effective thermal conductivity of a nanofluid using Brownian dynamics simulation
P Bhattacharya, SK Saha, A Yadav, PE Phelan, RS Prasher
Heat Transfer Summer Conference 36959, 777-783, 2003
52003
Molecular dynamics simulation of thermal transport at nanometer size point contacts on a planar silicon substrate
S Saha, L Shi
Heat Transfer Summer Conference 47314, 389-396, 2005
42005
Simulated behavior of magnetic and nonmagnetic particles in a rotating magnetic field
SK Saha
Arizona State University, 2003
42003
Challenges and opportunities in thermal management of multi-chip packages
HK Dhavaleswarapu, CM Jha, SF Smith, S Kothari, B Bicen, SK Saha, ...
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
32015
Reliability of base-isolated liquid storage tanks under horizontal base excitation
SK Saha, VA Matsagar
Numerical methods for reliability and safety assessment: Multiscale and …, 2015
32015
Wind Response of Base-Isolated Building
SK Saha, VA Matsagar, A Gupta
14th International Conference on Wind Engineering, Porto Alegre, Brazil, 2015
32015
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