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Inanc MericIntel Co.Verified email at intel.com
Yuanda GaoIntel Corporation, Columbia UniversityVerified email at columbia.edu
Patrick MaherGraduate Research Assistant, Columbia UniversityVerified email at phys.columbia.edu
Yufeng HaoProfessor of Materials Science and Engineering, Nanjing UniversityVerified email at nju.edu.cn
Mikito KoshinoDepartment of Physics, Osaka UniversityVerified email at phys.sci.osaka-u.ac.jp
Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
Fereshte GhahariAssistant Professor of Physics, George Mason UniversityVerified email at gmu.edu
Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu
Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaVerified email at khu.ac.kr
Yuanyue LiuAssociate Professor, The University of Texas at AustinVerified email at austin.utexas.edu
Fan ZhangMechanical Engineering, Columbia UniversityVerified email at columbia.edu
Chul-Ho LeeAssociate Professor, Seoul National University & Korea University (2014~2022)Verified email at snu.ac.kr
Hechen RenHarvard UniversityVerified email at physics.harvard.edu
Luigi ColomboUniversity of Texas at DallasVerified email at utdallas.edu
Tony LowU of Minnesota, IBM Research, Columbia U, Purdue U, National U SingaporeVerified email at us.ibm.com
Nicholas PetroneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
Annie Xian ZhangMechanical Engineering, Stevens Institute of TechnologyVerified email at stevens.edu
Wenzhuo Wu (武文倬)School of IE; Flex Lab; Birck Nanotechnology Center; Purdue Quantum Science&Engineering InstituteVerified email at purdue.edu
Yilei LiPreviously Department of Physics, Stanford UniversityVerified email at stanford.edu
Masa IshigamiUniversity of Central FloridaVerified email at ucf.edu