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Co-authors
- Bert MoonsAxelera AI, previously at Qualcomm AI Research and KU LeuvenVerified email at axelera.ai
- Wannes MeertDTAI, KU LeuvenVerified email at cs.kuleuven.be
- Sofie PollinProfessor Electrical Engineering, KU LeuvenVerified email at esat.kuleuven.be
- Steven LauwereinsResearch Lead, Televic RailVerified email at televic.com
- Chris Van HoofimecVerified email at imec.be
- Georges GielenKU Leuven (University of Leuven)Verified email at kuleuven.be
- Nick Van HelleputteimecVerified email at imec.be
- Venkata Rajesh PamulaUniversity of Washington SeattleVerified email at uw.edu
- Komail BadamiCSEMVerified email at csem.ch
- Boris MurmannUniversity of HawaiiVerified email at hawaii.edu
- Fernando E. RosasLecturer at University of SussexVerified email at sussex.ac.uk
- Koen GoetschalckxSystem architect, Axelera AIVerified email at kuleuven.be
- Hasnain lakdawalaPrincipal EngineerVerified email at qti.qualcomm.com
- Daniel BankmanAnalog IC Designer, AppleVerified email at apple.com
- michiel steyaertProfessor KULeuven Dept. Electrical Engineering - MICASVerified email at esat.kuleuven.be
- Liesbet Van der PerreKULeuvenVerified email at kuleuven.be
- Iman KhajenasiriCochlear Implants , ASIC architectVerified email at esat.kuleuven.be
- Refet Firat YaziciogluVice President, Galvani BioelectronicsVerified email at galvani.bio
- Andre BourdouxIMECVerified email at imec.be
- paolo madogliointelVerified email at intel.com